I-Cite Vision Chips™
High-level Configurable Operating Modules
Image Processing Vision Chips. provide the algorithms and parameters for processing the machine vision application. Sub-pixel algorithms maximize the accuracy of measurements.
Communication Vision Chips provide communication between the I-Cite application and the mechanical system on which it is running.
System Vision Chips provide the infrastructure for controlling the flow of the circuit(s) in the project.
Security
Four password-controlled access levels prevent unauthorized personnel from accessing critical functions and controls. The access level determines the availability of features and is configurable.
- Operator
- Supervisor
- Process Engineer
- System Configuration
Image Processing Vision Chips. The image processing capabilities in these Chips are among the fastest and most robust in the industry. A few of the capabilities include:
Pattern recognition: Patterns can be user-taught using one of three methods.
- Blob - A pattern may be a binary low-frequency object
- Model - A geometric pattern
- Edges - A high frequency grayscale feature.
The user can train one pattern for measuring X/Y translation or two patterns for measuring X/Y translation and rotation.
Measurement: Finds physical features and measures distances between them such as object edges or circular arcs. Features can also be calculated from the combination of physical features such as the extension to intersection of two physical edges into a X,Y point, or the distance between two lines. These virtual features can have a tolerance assigned to them.
Sub-pixel Edge Detection: Measures the distance between two edges with accuracy of one quarter of a pixel.
Defect Detection: Checks for abrupt grayscale changes (defects) in an otherwise uniform surface. The inspected area can be outlined by a Region Of Interest (ROI) box, a defining polygon, or the entire image. Parameters are available to define the defect size range and the type of detection algorithm to use.
Mark Inspection: Performs mark inspections on part of an image, automatically choosing alignment features in the image so it can compensate for movement of the mark in the image from part to part.
Two-dimensional Lead Inspections: Inspections on the leads of Integrated Circuit chips, including lead pitch, lead span, lead length, and lead tip co-linearity on a per side basis.
Communications Vision Chips configure communication between the I-Cite application and the mechanical system on which it is running. A few of the basic capabilities are:
- Pulse I/O: The capability to turn a digital I/O output line on and off again with the on period set for a prescribed amount of time.
- Read I/O. Specifies whether to read digital I/O Input lines singly or in a group of up to eight lines or bits.
- Wait I/O. Synchronizes the I-Cite software with the mechanical system on which it is running by waiting for a command signal to begin the inspection sequence defined in the circuit.
- Write I/O. Provides the capability to turn digital I/O output lines on or off.
System Vision Chips control the flow of an I-Cite vision application. A few of the basic capabilities are:
- Start: Provides the starting point for every circuit.
- Load Image: Retrieves an image from the specified directory and file name
- Draw 2D:Provides the capability to display graphic information on the I-Cite window
- Display: Forces a the refresh of the view(s) in the chips of the circuit
- Delay: Performs a delay operation in a circuit for operations such as synchronizing operation with machinery.
- Timer: Measures the execution time of a sequence of chips in a circuit. Used in pairs.
- Loop: Performs loops in a circuit
- Save Image: Saves image to the specified directory and file name
- Failure Packet: Provides an extensive information save capability for parts that have failed inspection