I-Cite Applications

I-Cite-based systems are designed into handling and inspection equipment in the semiconductor, electronic assembly, food processing, pharmaceutical, and automotive industries. Some specific applications include:

3D Lead Inspection
3D BGA Inspection
3D Five-Sided QFN
2D Two-Sided Inspection

• Pre and Post Singulation BGA, and Pad Inspection
• In tray and In tape Mark, Pin one and Lead inspection
• Solder paste inspection
• Die surface defect inspection
• Target tracking (infrared)
• High resolution, non-contact temperature measurement
• Porosity detection on machined parts
• Wiring harness assembly verification (weld and color inspection)
• Egg inspection (shell defects and dirt, and size)

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